Semiconductors and Data Center Systems
Chips, data centers, power orchestration, and advanced cooling.
Overview
End‑to‑end platforms that span chip R&D enablement, advanced packaging, and hyperscale data centers—optimizing power, thermal, and workload efficiency across liquid/immersion cooling and grid‑aware orchestration.
Core Capabilities
Chip design enablement and test benches
Advanced packaging and chiplet evaluation
Data center power systems and microgrids
Liquid and immersion cooling pilots
Thermal simulation and facility digital twins
Reliability, monitoring, and firmware/ops
Active Programs
Key Technologies
Platforms & Solutions
DCIM connectors and telemetry stack
Energy and demand‑response management
Thermal/facility digital twin
Integrations
Frequently Asked Questions
Do you retrofit existing data centers?
Yes. We phase deployments for liquid/immersion cooling, power upgrades, and telemetry integration with minimal downtime.
How do you reduce energy consumption?
Thermal digital twins, workload scheduling, and grid‑aware dispatch improve PUE and total cost of ownership.
What interfaces are supported?
Redfish/IPMI, DCIM vendor APIs, OPC UA/Modbus for facility systems, and BMC integrations.
Do you support chip R&D?
Tooling, test benches, and packaging evaluation with measurement pipelines and data governance.
Resources & Downloads
Ready to Learn More?
Explore our research, ongoing projects, and detailed technical documentation.