End‑to‑end platforms that span chip R&D enablement, advanced packaging, and hyperscale data centers—optimizing power, thermal, and workload efficiency across liquid/immersion cooling and grid‑aware orchestration.
Capabilities
- Chip design enablement and test benches
- Advanced packaging and chiplet evaluation
- Data center power systems and microgrids
- Liquid and immersion cooling pilots
- Thermal simulation and facility digital twins
- Reliability, monitoring, and firmware/ops
Programs
- Liquid/immersion cooling rollouts
- Power orchestration and demand response
- Chiplet prototyping and packaging labs
- Thermal modeling and verification
- DCIM and telemetry integrations
Key Technologies
Immersion and direct‑to‑chip liquid coolingAdvanced packaging and chipletsDC bus and high‑efficiency conversionWaste‑heat recovery and reuseAI‑assisted workload schedulers
Frequently Asked Questions
Do you retrofit existing data centers?
Yes. We phase deployments for liquid/immersion cooling, power upgrades, and telemetry integration with minimal downtime.
How do you reduce energy consumption?
Thermal digital twins, workload scheduling, and grid‑aware dispatch improve PUE and total cost of ownership.
What interfaces are supported?
Redfish/IPMI, DCIM vendor APIs, OPC UA/Modbus for facility systems, and BMC integrations.
Do you support chip R&D?
Tooling, test benches, and packaging evaluation with measurement pipelines and data governance.
Ready to Collaborate?
Explore partnership opportunities or learn more about our Semiconductors and Data Center Systems capabilities.